JPH0421646Y2 - - Google Patents
Info
- Publication number
- JPH0421646Y2 JPH0421646Y2 JP15674987U JP15674987U JPH0421646Y2 JP H0421646 Y2 JPH0421646 Y2 JP H0421646Y2 JP 15674987 U JP15674987 U JP 15674987U JP 15674987 U JP15674987 U JP 15674987U JP H0421646 Y2 JPH0421646 Y2 JP H0421646Y2
- Authority
- JP
- Japan
- Prior art keywords
- jet
- nozzle
- solder
- printed circuit
- molten solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 40
- 239000007788 liquid Substances 0.000 claims description 18
- 238000005476 soldering Methods 0.000 claims description 7
- 230000000694 effects Effects 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 230000002411 adverse Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15674987U JPH0421646Y2 (en]) | 1987-10-15 | 1987-10-15 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15674987U JPH0421646Y2 (en]) | 1987-10-15 | 1987-10-15 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0160765U JPH0160765U (en]) | 1989-04-18 |
JPH0421646Y2 true JPH0421646Y2 (en]) | 1992-05-18 |
Family
ID=31435567
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15674987U Expired JPH0421646Y2 (en]) | 1987-10-15 | 1987-10-15 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0421646Y2 (en]) |
-
1987
- 1987-10-15 JP JP15674987U patent/JPH0421646Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPH0160765U (en]) | 1989-04-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4253374B2 (ja) | プリント基板のはんだ付け方法および噴流はんだ槽 | |
US20110139855A1 (en) | Residual oxygen measurement and control in wave soldering process | |
JPH0421646Y2 (en]) | ||
JPH0790360B2 (ja) | 回路基板へのハンダ付け方法及びその装置 | |
CN212217369U (zh) | 一种搪锡喷嘴及装置 | |
JP2000200966A (ja) | 局所フロ―はんだ付装置 | |
JPH03155465A (ja) | 噴流式ハンダ付装置の噴流調整方法 | |
JP2003023245A (ja) | 噴流型ハンダ付装置 | |
JPH0641722Y2 (ja) | 噴流はんだ槽 | |
JPH0810942A (ja) | 半田槽の液面制御装置 | |
JPS6343193B2 (en]) | ||
JPH0530849Y2 (en]) | ||
JP2864705B2 (ja) | Tab用フイルムキャリアテープ及びそのリードへのはんだ被覆方法 | |
JPS6121170Y2 (en]) | ||
JP2004311852A (ja) | 噴流はんだ槽 | |
JPH11103161A (ja) | 局所噴流半田付け装置 | |
JPS6023099Y2 (ja) | 静止はんだ浴 | |
JPS63220973A (ja) | 噴流はんだ槽 | |
JPS6113156Y2 (en]) | ||
JPS5884672A (ja) | はんだ付け方法 | |
JP3017533U (ja) | 噴流はんだ槽 | |
JPS63170071U (en]) | ||
KR100271144B1 (ko) | 납땜기의납흐름높이자동측정장치 | |
JPH0144221Y2 (en]) | ||
KR19990011481A (ko) | 인쇄회로기판용 납땜장치 |