JPH0421646Y2 - - Google Patents

Info

Publication number
JPH0421646Y2
JPH0421646Y2 JP15674987U JP15674987U JPH0421646Y2 JP H0421646 Y2 JPH0421646 Y2 JP H0421646Y2 JP 15674987 U JP15674987 U JP 15674987U JP 15674987 U JP15674987 U JP 15674987U JP H0421646 Y2 JPH0421646 Y2 JP H0421646Y2
Authority
JP
Japan
Prior art keywords
jet
nozzle
solder
printed circuit
molten solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP15674987U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0160765U (en]
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15674987U priority Critical patent/JPH0421646Y2/ja
Publication of JPH0160765U publication Critical patent/JPH0160765U/ja
Application granted granted Critical
Publication of JPH0421646Y2 publication Critical patent/JPH0421646Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP15674987U 1987-10-15 1987-10-15 Expired JPH0421646Y2 (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15674987U JPH0421646Y2 (en]) 1987-10-15 1987-10-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15674987U JPH0421646Y2 (en]) 1987-10-15 1987-10-15

Publications (2)

Publication Number Publication Date
JPH0160765U JPH0160765U (en]) 1989-04-18
JPH0421646Y2 true JPH0421646Y2 (en]) 1992-05-18

Family

ID=31435567

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15674987U Expired JPH0421646Y2 (en]) 1987-10-15 1987-10-15

Country Status (1)

Country Link
JP (1) JPH0421646Y2 (en])

Also Published As

Publication number Publication date
JPH0160765U (en]) 1989-04-18

Similar Documents

Publication Publication Date Title
JP4253374B2 (ja) プリント基板のはんだ付け方法および噴流はんだ槽
US20110139855A1 (en) Residual oxygen measurement and control in wave soldering process
JPH0421646Y2 (en])
JPH0790360B2 (ja) 回路基板へのハンダ付け方法及びその装置
CN212217369U (zh) 一种搪锡喷嘴及装置
JP2000200966A (ja) 局所フロ―はんだ付装置
JPH03155465A (ja) 噴流式ハンダ付装置の噴流調整方法
JP2003023245A (ja) 噴流型ハンダ付装置
JPH0641722Y2 (ja) 噴流はんだ槽
JPH0810942A (ja) 半田槽の液面制御装置
JPS6343193B2 (en])
JPH0530849Y2 (en])
JP2864705B2 (ja) Tab用フイルムキャリアテープ及びそのリードへのはんだ被覆方法
JPS6121170Y2 (en])
JP2004311852A (ja) 噴流はんだ槽
JPH11103161A (ja) 局所噴流半田付け装置
JPS6023099Y2 (ja) 静止はんだ浴
JPS63220973A (ja) 噴流はんだ槽
JPS6113156Y2 (en])
JPS5884672A (ja) はんだ付け方法
JP3017533U (ja) 噴流はんだ槽
JPS63170071U (en])
KR100271144B1 (ko) 납땜기의납흐름높이자동측정장치
JPH0144221Y2 (en])
KR19990011481A (ko) 인쇄회로기판용 납땜장치